Building with nanoparticles, from the bottom up

Researchers at MIT have developed a technique for precisely controlling the arrangement and placement of nanoparticles on a material, like the silicon used for computer chips, in a way that does not damage or contaminate the surface of the material. The technique, which combines chemistry and directed assembly processes with conventional fabrication techniques, enables the efficient formation of high-resolution, nanoscale features integrated with nanoparticles for devices like sensors, lasers, and LEDs, which could boost their performance. Transistors and other nanoscale devices are typically fabricated from the top down — materials…

This content is for Member members only.
Log In Register