To expand the types of materials that researchers can process, MIT.nano has acquired a new SAMCO inductively coupled plasma (ICP) reactive-ion etching (RIE) system. The instrument has been installed and qualified on the third floor of MIT.nano, where it is now available for training and use. Reactive-ion etching is a material removal process performed under low pressure in which a reactive plasma is generated to remove the material on the substrate. With inductively coupled plasma RIE, the plasma is generated by a radio-frequency-powered magnetic field to ionize different gases. The…